W25Q128JVSIQ
Identity
- Manufacturer: Winbond(华邦)
- Model / MPN: W25Q128JVSIQ
- LCSC: C97521
- Category: flash-memory
- Description: W25Q128JVSIQ 3V 128Mbit serial flash; dual/quad SPI; 2.7V~3.6V; 133MHz; 1uA standby; 100,000 Cycles; Tpp 3ms; tBE 120ms@(32KB)
- Source: EasyEDA/JLC verified common component seed
- Project designators: Not project-specific
- Project quantity per board: Not project-specific
Capabilities
- spi: interface
Package And Footprint
- Package / footprint name: SOIC-8-208mil
- Pin count: 8
- EasyEDA symbol UUID: d7cd8fe8aa9c4c26a1a93effbf3073d8
- EasyEDA footprint UUID: 72583753d3274002a417cc5a35a8cf6f
- EasyEDA device UUID: 186ba0074f284af0924bbcb475a8676a
- EasyEDA library UUID: 0819f05c4eef4c71ace90d822a990e87
Power And Operating Modes
- Active current: Not characterized in seed; extract active current from datasheet tables.
- Sleep / standby current: Not characterized in seed; extract sleep/standby current from datasheet tables.
- Supply rails: EasyEDA property: 2.7V~3.6V.
- Notes: Seed values are search hints only. Verify power modes, rail limits, startup requirements, and reference design passives from the datasheet.
Procurement Classification
- JLC class: Basic Part
- JLC note / assembly basis: EasyEDA/JLC verified common memory, timing, storage, and security seed
- Assembly status: jlc_basic
- Price-break table: Not captured in seed. Store only timestamped price-break snapshots when intentionally refreshed.
- Live stock: intentionally not stored as durable selection data; refresh externally before ordering.
Datasheet And Links
- Datasheet / product URL: https://item.szlcsc.com/datasheet/W25Q128JVSIQ/98729.html
- Product URL: https://item.szlcsc.com/datasheet/W25Q128JVSIQ/98729.html
- Datasheet-derived notes: Not extracted yet. Use PDF extraction to fill power modes, absolute maximums, pin functions, package variants, and reference design requirements.
Selection Notes
- Good for: external firmware storage, OTA staging, logs, filesystems, fonts, assets, and calibration blobs over SPI/QSPI
- Avoid when: Not captured yet.
- Known layout constraints: Verify package land pattern, decoupling requirements, thermal pad, RF keepouts, crystal routing, and boot straps from the datasheet.
- Equivalent search hints: match category
flash-memory, interfaces spi, packageSOIC-8-208mil, and EasyEDA footprint UUID72583753d3274002a417cc5a35a8cf6f.
Search Keywords
seed:common-memory-timing-security, source:easyeda-bridge, iot, common-pcb, storage, timing, security, w25q128, spi-nor, 128mbit, winbond, basic-part, flash-memory, soic-8-208mil, jlc-basic, spi, jlc_basic, jlc-note:easyeda-jlc-verified-common-memory-timing-storage-and-security-seed