ISO7741DBQR

Identity

• Manufacturer: TI(德州仪器)
• Model / MPN: ISO7741DBQR
• LCSC: C913840
• Category: digital-isolator
• Description: Enhanced high-speed 4-channel digital isolator with excellent EMC, 3 forward/1 reverse, 100Mbps, high default output, 3000Vrms, 100kV/us CMTI.
• Source: EasyEDA/JLC verified common component seed
• Project designators: Not project-specific
• Project quantity per board: Not project-specific

Capabilities

• Not captured yet.

Package And Footprint

• Package / footprint name: SSOP-16-150mil
• Pin count: 16
• EasyEDA symbol UUID: 7ef2ea863a6b43f1ac0fad7bedf6d49d
• EasyEDA footprint UUID: b0d55ab418e040e8bef9bf96f54e5068
• EasyEDA device UUID: e0ff0274ae464728addca6915787fc59
• EasyEDA library UUID: 0819f05c4eef4c71ace90d822a990e87

Power And Operating Modes

• Active current: Not characterized in seed; extract active current from datasheet tables.
• Sleep / standby current: Not characterized in seed; extract sleep/standby current from datasheet tables.
• Supply rails: Not characterized in seed; capture allowed supply rail range from datasheet.
• Notes: Seed values are search hints only. Verify power modes, rail limits, startup requirements, and reference design passives from the datasheet.

Procurement Classification

• JLC class: Extended Part
• JLC note / assembly basis: EasyEDA/JLC verified second-source/alternate seed for IC categories that only had one option
• Assembly status: jlc_extended
• Price-break table: Not captured in seed. Store only timestamped price-break snapshots when intentionally refreshed.
• Live stock: intentionally not stored as durable selection data; refresh externally before ordering.

Datasheet And Links

• Datasheet / product URL: https://www.ti.com/cn/lit/gpn/iso7740
• Product URL: https://www.ti.com/cn/lit/gpn/iso7740
• Datasheet-derived notes: Not extracted yet. Use PDF extraction to fill power modes, absolute maximums, pin functions, package variants, and reference design requirements.

Selection Notes

• Good for: reuse when package, electrical ratings, footprint, and assembly class match the project constraints
• Avoid when: Not captured yet.
• Known layout constraints: Verify package land pattern, decoupling requirements, thermal pad, RF keepouts, crystal routing, and boot straps from the datasheet.
• Equivalent search hints: match category digital-isolator, interfaces none captured, package SSOP-16-150mil, and EasyEDA footprint UUID b0d55ab418e040e8bef9bf96f54e5068.

Search Keywords

seed:common-single-option-category-expansion, source:easyeda-bridge, second-source, common-pcb, iso7741, quad-channel, reinforced-isolation, second-source-of:adum1201, digital-isolator, ssop-16-150mil, jlc-extended, jlc_extended, jlc-note:easyeda-jlc-verified-second-source-alternate-seed-for-ic-categories-that-only-had-one-option