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5001B-ESIM175-199

C53278148

NANO SIM flip-type connector

footprint
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assets
Datasheet or product page datasheet
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Datasheet PDF (mirrored) datasheet pdf
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EasyEDA 3D model easyeda 3d model
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EasyEDA device easyeda device
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SMD easyeda footprint
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EasyEDA library easyeda library
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EasyEDA Pro device: C53278148 easyeda pro device
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EasyEDA Pro library (device+symbol+footprint): C53278148 easyeda pro lib
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EasyEDA symbol easyeda symbol
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JLC/LCSC product image jlc image
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JLC/LCSC product image jlc image
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3D model (OBJ) model 3d obj
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3D model (STEP) model 3d step
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engineering profile

5001B-ESIM175-199

Identity

  • Manufacturer: JMEconn(文章济美)
  • Model / MPN: 5001B-ESIM175-199
  • LCSC: C53278148
  • Category: sim-card-connector
  • Description: NANO SIM flip-type connector
  • Source: EasyEDA/JLC verified common component seed
  • Project designators: Not project-specific
  • Project quantity per board: Not project-specific

Capabilities

  • sim: interface

Package And Footprint

  • Package / footprint name: SMD
  • Pin count: Unknown
  • EasyEDA symbol UUID: 4243749e068641cb80ef5e6f8b5e203f
  • EasyEDA footprint UUID: 505b78ecb5b04f608971158806236b78
  • EasyEDA device UUID: 62cc75d82dc14864a628d40f36314566
  • EasyEDA library UUID: 0819f05c4eef4c71ace90d822a990e87

Power And Operating Modes

  • Active current: Passive part; no quiescent current.
  • Sleep / standby current: Passive part; no quiescent current.
  • Supply rails: Application-defined.
  • Notes: Ratings are seeded from EasyEDA/LCSC properties when present; verify against datasheet for final design.

Procurement Classification

  • JLC class: Extended Part
  • JLC note / assembly basis: EasyEDA/JLC verified common connectivity, positioning, and RF interface seed
  • Assembly status: jlc_extended
  • Price-break table: Not captured in seed. Store only timestamped price-break snapshots when intentionally refreshed.
  • Live stock: intentionally not stored as durable selection data; refresh externally before ordering.

Datasheet And Links

Selection Notes

  • Good for: reuse when package, electrical ratings, footprint, and assembly class match the project constraints
  • Avoid when: Not captured yet.
  • Known layout constraints: Verify package land pattern, decoupling requirements, thermal pad, RF keepouts, crystal routing, and boot straps from the datasheet.
  • Equivalent search hints: match category sim-card-connector, interfaces sim, package SMD, and EasyEDA footprint UUID 505b78ecb5b04f608971158806236b78.

Search Keywords

seed:common-connectivity-positioning, source:easyeda-bridge, iot, common-pcb, nano-sim, hinged, flip-cover, low-profile, sim-card-connector, smd, jlc-extended, sim, jlc_extended, jlc-note:easyeda-jlc-verified-common-connectivity-positioning-and-rf-interface-seed

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