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SMO-1513-T

C428455

Hinged-lid MicroSIM card connector with ejector, 1.5mm height above board, -25°C~+70°C.

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Datasheet or product page datasheet
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Datasheet PDF (mirrored) datasheet pdf
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EasyEDA device easyeda device
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SMD easyeda footprint
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EasyEDA library easyeda library
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EasyEDA Pro device: C428455 easyeda pro device
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EasyEDA Pro library (device+symbol+footprint): C428455 easyeda pro lib
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EasyEDA symbol easyeda symbol
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JLC/LCSC product image jlc image
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JLC/LCSC product image jlc image
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engineering profile

SMO-1513-T

Identity

  • Manufacturer: SOFNG(硕方)
  • Model / MPN: SMO-1513-T
  • LCSC: C428455
  • Category: sim-card-connector
  • Description: Hinged-lid MicroSIM card connector with ejector, 1.5mm height above board, -25°C~+70°C.
  • Source: EasyEDA/JLC verified common component seed
  • Project designators: Not project-specific
  • Project quantity per board: Not project-specific

Capabilities

  • sim: interface

Package And Footprint

  • Package / footprint name: SMD
  • Pin count: Unknown
  • EasyEDA symbol UUID: 6af3a97b06054a25beb82c1a393e3dd8
  • EasyEDA footprint UUID: c40ec0dab9a14bf0bbe15d2b379e6dba
  • EasyEDA device UUID: 91f14d80325a4ed4942694c9b3b44b29
  • EasyEDA library UUID: 0819f05c4eef4c71ace90d822a990e87

Power And Operating Modes

  • Active current: Passive part; no quiescent current.
  • Sleep / standby current: Passive part; no quiescent current.
  • Supply rails: Application-defined.
  • Notes: Ratings are seeded from EasyEDA/LCSC properties when present; verify against datasheet for final design.

Procurement Classification

  • JLC class: Extended Part
  • JLC note / assembly basis: EasyEDA/JLC verified common connectivity, positioning, and RF interface seed
  • Assembly status: jlc_extended
  • Price-break table: Not captured in seed. Store only timestamped price-break snapshots when intentionally refreshed.
  • Live stock: intentionally not stored as durable selection data; refresh externally before ordering.

Datasheet And Links

Selection Notes

  • Good for: reuse when package, electrical ratings, footprint, and assembly class match the project constraints
  • Avoid when: Not captured yet.
  • Known layout constraints: Verify package land pattern, decoupling requirements, thermal pad, RF keepouts, crystal routing, and boot straps from the datasheet.
  • Equivalent search hints: match category sim-card-connector, interfaces sim, package SMD, and EasyEDA footprint UUID c40ec0dab9a14bf0bbe15d2b379e6dba.

Search Keywords

seed:common-connectivity-positioning, source:easyeda-bridge, iot, common-pcb, micro-sim, hinged, flip-cover, 1.5mm, sim-card-connector, smd, jlc-extended, sim, jlc_extended, jlc-note:easyeda-jlc-verified-common-connectivity-positioning-and-rf-interface-seed, connector

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