E22-900M22S
Identity
- Manufacturer: EBYTE(亿佰特)
- Model / MPN: E22-900M22S
- LCSC: C411293
- Category: lora-module
- Description: 868/915MHz SMT LoRa module, 2.5V~3.7V, SPI, 22.3dBm, LoRa/FSK, Stamp Hole Antenna/IPEX interface, RX 6.8mA, TX 119mA, -147dBm
- Source: EasyEDA/JLC verified common component seed
- Project designators: Not project-specific
- Project quantity per board: Not project-specific
Capabilities
- spi: interface
Package And Footprint
- Package / footprint name: SMD,20x14mm
- Pin count: Unknown
- EasyEDA symbol UUID: 7d8c1ef39ab948e79c4dffc6ab140642
- EasyEDA footprint UUID: e387697150d847709d0e21c3a04ee510
- EasyEDA device UUID: 6377facb216a41b48a69d3516e3bc08f
- EasyEDA library UUID: 0819f05c4eef4c71ace90d822a990e87
Power And Operating Modes
- Active current: EasyEDA property: 6.8mA.
- Sleep / standby current: Not characterized in seed; extract sleep/standby current from datasheet tables.
- Supply rails: EasyEDA property: 2.5V~3.7V.
- Notes: Seed values are search hints only. Verify power modes, rail limits, startup requirements, and reference design passives from the datasheet.
Procurement Classification
- JLC class: Extended Part
- JLC note / assembly basis: EasyEDA/JLC verified common connectivity, positioning, and RF interface seed
- Assembly status: jlc_extended
- Price-break table: Not captured in seed. Store only timestamped price-break snapshots when intentionally refreshed.
- Live stock: intentionally not stored as durable selection data; refresh externally before ordering.
Datasheet And Links
- Datasheet / product URL: https://item.szlcsc.com/datasheet/E22-900M22S/402604.html
- Product URL: https://item.szlcsc.com/datasheet/E22-900M22S/402604.html
- Datasheet-derived notes: Not extracted yet. Use PDF extraction to fill power modes, absolute maximums, pin functions, package variants, and reference design requirements.
Selection Notes
- Good for: reuse when package, electrical ratings, footprint, and assembly class match the project constraints
- Avoid when: Not captured yet.
- Known layout constraints: Verify package land pattern, decoupling requirements, thermal pad, RF keepouts, crystal routing, and boot straps from the datasheet.
- Equivalent search hints: match category
lora-module, interfaces spi, packageSMD,20x14mm, and EasyEDA footprint UUIDe387697150d847709d0e21c3a04ee510.
Search Keywords
seed:common-connectivity-positioning, source:easyeda-bridge, iot, common-pcb, e22-900m22s, sx1262, 868mhz, 915mhz, lora, ipex, lora-module, smd-20x14mm, jlc-extended, spi, jlc_extended, jlc-note:easyeda-jlc-verified-common-connectivity-positioning-and-rf-interface-seed, power