EC200UCNLA-N05-SGNSA

Identity

Manufacturer: Quectel(移远)
Model / MPN: EC200UCNLA-N05-SGNSA
LCSC: C2916206
Category: cellular-module
Description: LTE Cat 1 module.
Source: EasyEDA/JLC verified common component seed
Project designators: Not project-specific
Project quantity per board: Not project-specific

Capabilities

uart: interface
usb: interface
i2c: interface
spi: interface
adc: interface
sim: interface

Package And Footprint

Package / footprint name: SMD,28x31mm
Pin count: Unknown
EasyEDA symbol UUID: 7d6b4138c17a4a33a9ae93c75d0c9203
EasyEDA footprint UUID: 293ea30bc48a46c685ed59ce554444bc
EasyEDA device UUID: 21fa7fc6834b4b61a9837524759dd391
EasyEDA library UUID: 0819f05c4eef4c71ace90d822a990e87

Power And Operating Modes

Active current: Not characterized in seed; extract active current from datasheet tables.
Sleep / standby current: Not characterized in seed; extract sleep/standby current from datasheet tables.
Supply rails: Not characterized in seed; capture allowed supply rail range from datasheet.
Notes: Seed values are search hints only. Verify power modes, rail limits, startup requirements, and reference design passives from the datasheet.

Procurement Classification

JLC class: Extended Part
JLC note / assembly basis: EasyEDA/JLC verified common connectivity, positioning, and RF interface seed
Assembly status: jlc_extended
Price-break table: Not captured in seed. Store only timestamped price-break snapshots when intentionally refreshed.
Live stock: intentionally not stored as durable selection data; refresh externally before ordering.

Datasheet And Links

Datasheet / product URL: https://atta.szlcsc.com/upload/public/pdf/source/20220309/3C2078D3551E384BF180A9D9DC9FCCD3.pdf
Product URL: https://atta.szlcsc.com/upload/public/pdf/source/20220309/3C2078D3551E384BF180A9D9DC9FCCD3.pdf
Datasheet-derived notes: Not extracted yet. Use PDF extraction to fill power modes, absolute maximums, pin functions, package variants, and reference design requirements.

Selection Notes

Good for: reuse when package, electrical ratings, footprint, and assembly class match the project constraints
Avoid when: Not captured yet.
Known layout constraints: Verify package land pattern, decoupling requirements, thermal pad, RF keepouts, crystal routing, and boot straps from the datasheet.
Equivalent search hints: match category cellular-module, interfaces uart, usb, i2c, spi, adc, sim, package SMD,28x31mm, and EasyEDA footprint UUID 293ea30bc48a46c685ed59ce554444bc.

Search Keywords

seed:common-connectivity-positioning, source:easyeda-bridge, iot, common-pcb, ec200u, lte-cat1, 4g, quectel, cellular-module, smd-28x31mm, jlc-extended, uart, usb, i2c, spi, adc, sim, jlc_extended, jlc-note:easyeda-jlc-verified-common-connectivity-positioning-and-rf-interface-seed