DL-RFM95-868M
Identity
- Manufacturer: DreamLNK(骏晔科技)
- Model / MPN: DL-RFM95-868M
- LCSC: C2844472
- Category: lora-module
- Description: sx1276 LORA/LoRaWAN long-range low-power transceiver module, 868MHz, 1.8V~3.7V, SPI, 19.5dBm, LoRa/MSK/GFSK/FSK/GMSK/OOK, RX 10.8mA, TX 120mA, -146dBm
- Source: EasyEDA/JLC verified common component seed
- Project designators: Not project-specific
- Project quantity per board: Not project-specific
Capabilities
- spi: interface
- lora: interface
Package And Footprint
- Package / footprint name: SMD,16x16mm
- Pin count: Unknown
- EasyEDA symbol UUID: 935d3ccc4ee241ba83fc0d6c29ee68d8
- EasyEDA footprint UUID: 3471ae28634046af89b8174c6f8c1114
- EasyEDA device UUID: a3157fb1936341b48b5f79c9c7c6fdba
- EasyEDA library UUID: 0819f05c4eef4c71ace90d822a990e87
Power And Operating Modes
- Active current: EasyEDA property: 10.8mA.
- Sleep / standby current: Not characterized in seed; extract sleep/standby current from datasheet tables.
- Supply rails: EasyEDA property: 1.8V~3.7V.
- Notes: Seed values are search hints only. Verify power modes, rail limits, startup requirements, and reference design passives from the datasheet.
Procurement Classification
- JLC class: Extended Part
- JLC note / assembly basis: EasyEDA/JLC verified common IoT sensors, storage, and communications seed
- Assembly status: jlc_extended
- Price-break table: Not captured in seed. Store only timestamped price-break snapshots when intentionally refreshed.
- Live stock: intentionally not stored as durable selection data; refresh externally before ordering.
Datasheet And Links
- Datasheet / product URL: https://item.szlcsc.com/datasheet/DL-RFM95-868M/3035422.html
- Product URL: https://item.szlcsc.com/datasheet/DL-RFM95-868M/3035422.html
- Datasheet-derived notes: Not extracted yet. Use PDF extraction to fill power modes, absolute maximums, pin functions, package variants, and reference design requirements.
Selection Notes
- Good for: reuse when package, electrical ratings, footprint, and assembly class match the project constraints
- Avoid when: Not captured yet.
- Known layout constraints: Verify package land pattern, decoupling requirements, thermal pad, RF keepouts, crystal routing, and boot straps from the datasheet.
- Equivalent search hints: match category
lora-module, interfaces spi, lora, packageSMD,16x16mm, and EasyEDA footprint UUID3471ae28634046af89b8174c6f8c1114.
Search Keywords
seed:common-iot-sensors-comms, source:easyeda-bridge, iot, common-pcb, rfm95, lora, 868mhz, spi, lora-module, smd-16x16mm, jlc-extended, jlc_extended, jlc-note:easyeda-jlc-verified-common-iot-sensors-storage-and-communications-seed, power