W25Q256JVFAM

Identity

• Manufacturer: Winbond(华邦)
• Model / MPN: W25Q256JVFAM
• LCSC: C2827531
• Category: flash-memory
• Description: W25Q256JVFAM 2.7V3.6V SPI Interface:SPI Memory Size:256Mbit Clock Frequency:133MHz Voltage - Supply:2.7V3.6V Voltage - Supply:2.7V3.6V Program / Erase Cycles:100,000 Cycles Page Programming Time (Tpp):4ms Data Retention - TDR (Year):20 Years Operating Temperature:-40℃+105℃ Oper
• Source: EasyEDA/JLC verified common component seed
• Project designators: Not project-specific
• Project quantity per board: Not project-specific

Capabilities

• spi: interface

Package And Footprint

• Package / footprint name: SOIC-16-300mil
• Pin count: 16
• EasyEDA symbol UUID: bfd19898851c4c68a8c51593f1b90359
• EasyEDA footprint UUID: a41f1966f94243aa8f26a77e5d7fd955
• EasyEDA device UUID: e7c123b6752349e49d00d9fc85bcff98
• EasyEDA library UUID: 0819f05c4eef4c71ace90d822a990e87

Power And Operating Modes

• Active current: Not characterized in seed; extract active current from datasheet tables.
• Sleep / standby current: Not characterized in seed; extract sleep/standby current from datasheet tables.
• Supply rails: EasyEDA property: 2.7V~3.6V.
• Notes: Seed values are search hints only. Verify power modes, rail limits, startup requirements, and reference design passives from the datasheet.

Procurement Classification

• JLC class: Extended Part
• JLC note / assembly basis: EasyEDA/JLC verified common memory, timing, storage, and security seed
• Assembly status: jlc_extended
• Price-break table: Not captured in seed. Store only timestamped price-break snapshots when intentionally refreshed.
• Live stock: intentionally not stored as durable selection data; refresh externally before ordering.

Datasheet And Links

• Datasheet / product URL: https://item.szlcsc.com/datasheet/W25Q256JVFAM/2973062.html
• Product URL: https://item.szlcsc.com/datasheet/W25Q256JVFAM/2973062.html
• Datasheet-derived notes: Not extracted yet. Use PDF extraction to fill power modes, absolute maximums, pin functions, package variants, and reference design requirements.

Selection Notes

• Good for: external firmware storage, OTA staging, logs, filesystems, fonts, assets, and calibration blobs over SPI/QSPI
• Avoid when: Not captured yet.
• Known layout constraints: Verify package land pattern, decoupling requirements, thermal pad, RF keepouts, crystal routing, and boot straps from the datasheet.
• Equivalent search hints: match category flash-memory, interfaces spi, package SOIC-16-300mil, and EasyEDA footprint UUID a41f1966f94243aa8f26a77e5d7fd955.

Search Keywords

seed:common-memory-timing-security, source:easyeda-bridge, iot, common-pcb, storage, timing, security, w25q256, spi-nor, 256mbit, winbond, soic-16, flash-memory, soic-16-300mil, jlc-extended, spi, jlc_extended, jlc-note:easyeda-jlc-verified-common-memory-timing-storage-and-security-seed