W25Q16JVSNIQ

Identity

Manufacturer: Winbond(华邦)
Model / MPN: W25Q16JVSNIQ
LCSC: C2456211
Category: flash-memory
Description: W25Q16JVSNIQ 3V 16Mbit serial flash; dual/quad SPI; 2.7V~3.6V; 133MHz; 100,000 Cycles; Tpp 400us; tBE 120ms@(32KB); TDR 20 Years
Source: EasyEDA/JLC verified common component seed
Project designators: Not project-specific
Project quantity per board: Not project-specific

Capabilities

spi: interface

Package And Footprint

Package / footprint name: SOIC-8
Pin count: 8
EasyEDA symbol UUID: f1e5f77711bf4d828c36c2e901f13941
EasyEDA footprint UUID: 114ea734da1646a1859a103ac7dff343
EasyEDA device UUID: 5208cfca8fe644fa97e7623cdcd2a5aa
EasyEDA library UUID: 0819f05c4eef4c71ace90d822a990e87

Power And Operating Modes

Active current: Not characterized in seed; extract active current from datasheet tables.
Sleep / standby current: Not characterized in seed; extract sleep/standby current from datasheet tables.
Supply rails: EasyEDA property: 2.7V~3.6V.
Notes: Seed values are search hints only. Verify power modes, rail limits, startup requirements, and reference design passives from the datasheet.

Procurement Classification

JLC class: Extended Part
JLC note / assembly basis: EasyEDA/JLC verified common memory, timing, storage, and security seed
Assembly status: jlc_extended
Price-break table: Not captured in seed. Store only timestamped price-break snapshots when intentionally refreshed.
Live stock: intentionally not stored as durable selection data; refresh externally before ordering.

Datasheet And Links

Datasheet / product URL: https://item.szlcsc.com/datasheet/W25Q16JVSNIQ/2548069.html
Product URL: https://item.szlcsc.com/datasheet/W25Q16JVSNIQ/2548069.html
Datasheet-derived notes: Not extracted yet. Use PDF extraction to fill power modes, absolute maximums, pin functions, package variants, and reference design requirements.

Selection Notes

Good for: external firmware storage, OTA staging, logs, filesystems, fonts, assets, and calibration blobs over SPI/QSPI
Avoid when: Not captured yet.
Known layout constraints: Verify package land pattern, decoupling requirements, thermal pad, RF keepouts, crystal routing, and boot straps from the datasheet.
Equivalent search hints: match category flash-memory, interfaces spi, package SOIC-8, and EasyEDA footprint UUID 114ea734da1646a1859a103ac7dff343.

Search Keywords

seed:common-memory-timing-security, source:easyeda-bridge, iot, common-pcb, storage, timing, security, w25q16, spi-nor, 16mbit, winbond, soic-8, flash-memory, jlc-extended, spi, jlc_extended, jlc-note:easyeda-jlc-verified-common-memory-timing-storage-and-security-seed