W25Q64JVSTIQ

Identity

• Manufacturer: Winbond(华邦)
• Model / MPN: W25Q64JVSTIQ
• LCSC: C19606588
• Category: flash-memory
• Description: W25Q64JVSTIQ 2.7V3.6V SPI Interface:SPI Memory Size:64Mbit Clock Frequency:133MHz Voltage - Supply:2.7V3.6V Voltage - Supply:2.7V3.6V Operating Temperature:-40℃+85℃ Operating Temperature:-40℃~+85℃
• Source: EasyEDA/JLC verified common component seed
• Project designators: Not project-specific
• Project quantity per board: Not project-specific

Capabilities

• spi: interface

Package And Footprint

• Package / footprint name: VSOP-8
• Pin count: Unknown
• EasyEDA symbol UUID: 4bc01ae6778d43b1b64b625487d5f9e5
• EasyEDA footprint UUID: 3cc662ce1ce843e2926021e48f870241
• EasyEDA device UUID: 22626911a75748488f9946d2e6072557
• EasyEDA library UUID: 0819f05c4eef4c71ace90d822a990e87

Power And Operating Modes

• Active current: Not characterized in seed; extract active current from datasheet tables.
• Sleep / standby current: Not characterized in seed; extract sleep/standby current from datasheet tables.
• Supply rails: EasyEDA property: 2.7V~3.6V.
• Notes: Seed values are search hints only. Verify power modes, rail limits, startup requirements, and reference design passives from the datasheet.

Procurement Classification

• JLC class: Extended Part
• JLC note / assembly basis: EasyEDA/JLC verified common IoT sensors, storage, and communications seed
• Assembly status: jlc_extended
• Price-break table: Not captured in seed. Store only timestamped price-break snapshots when intentionally refreshed.
• Live stock: intentionally not stored as durable selection data; refresh externally before ordering.

Datasheet And Links

• Datasheet / product URL: https://item.szlcsc.com/datasheet/W25Q64JVSTIQ/20894255.html
• Product URL: https://item.szlcsc.com/datasheet/W25Q64JVSTIQ/20894255.html
• Datasheet-derived notes: Not extracted yet. Use PDF extraction to fill power modes, absolute maximums, pin functions, package variants, and reference design requirements.

Selection Notes

• Good for: reuse when package, electrical ratings, footprint, and assembly class match the project constraints
• Avoid when: Not captured yet.
• Known layout constraints: Verify package land pattern, decoupling requirements, thermal pad, RF keepouts, crystal routing, and boot straps from the datasheet.
• Equivalent search hints: match category flash-memory, interfaces spi, package VSOP-8, and EasyEDA footprint UUID 3cc662ce1ce843e2926021e48f870241.

Search Keywords

seed:common-iot-sensors-comms, source:easyeda-bridge, iot, common-pcb, w25q64, nor-flash, external-flash, spi, flash-memory, vsop-8, jlc-extended, jlc_extended, jlc-note:easyeda-jlc-verified-common-iot-sensors-storage-and-communications-seed